
Analytical Verification of Stitching via Array Attenuation for EMI Compliance
Analytical verification of via array attenuation predicts cavity mode suppression, ensuring PCB layouts meet CISPR 32 Class B EMI compliance limits.

Analytical verification of via array attenuation predicts cavity mode suppression, ensuring PCB layouts meet CISPR 32 Class B EMI compliance limits.

Maintain ground via spacing below one-twentieth of dielectric wavelength to prevent slot leakage and pass radiated emissions testing.

Perimeter via pitch selection requires matching ground via spacing to less than one-twentieth of target frequency wavelength while verifying barrel plating thickness.
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